Advanced Chip Engineering Technology Inc

Corporate Assignee

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Details Advanced Chip Engineering Technology Inc Advanced Chip Engineering Technology Inc

: Active solid-state devices (e.g., transistors, solid-state diode
: Housing or package
: With semiconductor element forming part

: Corporate Assignee
: active

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Wafer level package with die receiving through-hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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Profile ID: LFUS-PAI-P-3296885

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