Superconductor technology: apparatus – material – process – High temperature devices – systems – apparatus – com- ponents,... – Information processing
505831, 505833, 505841, 505191, 365160, 365161, 257421, 257427, G11C 1144, G11C 11063, H01L 2718
A novel nonvolatile memory element or cell comprising a memory means consisting of at least one superconducting ring (21, 22) and a detector means consisting of a MOSFET. The superconducting ring and the MOSFET are arranged in such a manner that a magnetic flux created by the superconducting ring (21, 22) passes through a channel zone of the MOSFET. Information is held in the superconducting ring in a form of permanent current and is detected electrically as variation in the conductivity of the channel zone of the MOSFET.
patent: 3705393 (1972-12-01), Anacker et al.
patent: 3763407 (1973-10-01), Yazawa
patent: 3879715 (1975-04-01), Zappe
patent: 4831427 (1989-05-01), Coleman, Jr.
patent: 5011817 (1991-04-01), Hidaka et al.
patent: 5039656 (1991-08-01), Hidaka et al.
patent: 5041880 (1991-08-01), Nojima et al.
patent: 5051737 (1991-09-01), Hasegawa
Terlep, "Nonvolatile, NDRO, Array Logic Memory Cell in Josephson Technology," IBM Tech. Disc. Bull vol. 17, No. 3, Aug 1974, pp. 890-891.
"Low-Temperature Characterization of Buried Channel NMOST" by Wilcox et al., IEEE Transactions on Electron Devices, vol. 36, No. 8, Aug. 1989, pp. 1440-1441.
Ellis, "Superconductors," Journal of Chemical Education, vol. 64, No. 10, Oct. '87, pp. 836-841.
Dixon Joseph L.
Sumitomo Electric Industries Ltd
Whitefield Michael A.
Nonvolatile memory element composed of combined superconductor r does not yet have a rating. At this time, there are no reviews or comments for this patent.If you have personal experience with Nonvolatile memory element composed of combined superconductor r, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nonvolatile memory element composed of combined superconductor r will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1053222