Thin-film resin substrate used in a high-frequency module

Details Thin-film resin substrate used in a high-frequency module Thin-film resin substrate used in a high-frequency module

2006-08-01

2006-08-01

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

07084352

ABSTRACT:
A thin-film resin substrate having a first surface provided with a high-frequency electronic circuit and a second unleveled surface opposite the first surface. The second surface has raised portions and recessed portions, and the electronic circuit contains interconnections, at least some of which extend over regions corresponding to the recessed portions of the second surface so as to reinforce mechanical strength of the thin-film resin substrate at the regions corresponding to the recessed portions.

REFERENCES:
patent: 5750423 (1998-05-01), Ishii
patent: 5864174 (1999-01-01), Yamada et al.
patent: 5886877 (1999-03-01), Shingai et al.
patent: 5972735 (1999-10-01), Dominic
patent: 5999413 (1999-12-01), Ohuchi et al.
patent: 6650548 (2003-11-01), Swetland
patent: 2001-012737 (2001-01-01), None
patent: 2001-0127237 (2001-01-01), None

Affiliated with

Also associated with

Rating

Thin-film resin substrate used in a high-frequency module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin-film resin substrate used in a high-frequency module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin-film resin substrate used in a high-frequency module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3715286