Thermal treatment apparatus

Details Thermal treatment apparatus Thermal treatment apparatus

1982-09-15

1984-08-28

Camby, John J.

Heating

Having condition responsive control

198774, 414180, 432239, F27B 126, F27D 300, B65G 2500

Patent

active

044681950

ABSTRACT:
The semiconductor device manufacturing process for producing semiconductors (transistor, IC, LSI or the like) needs a large number of thermal treatments for semiconductor wafers, such as thermal oxidation, diffusion, CVD, annealing or the like. The above-mentioned various thermal treatments are conducted by employing thermal treatment apparatus. The thermal treatment apparatus according to the present invention performs thermal treatments for semiconductor wafers, such as thermal oxidation, diffusion, CVD, annealing or the like, and has a soft landing loader capable of loading and unloading a wafer jig housing therein a plurality of semiconductor wafers into and from a process tube of the thermal treatment apparatus with high reliability and a high thermal efficiency as well as capable of automatic control of the movement of the semiconductor wafers in accordance with thermal treatment conditions.

REFERENCES:
patent: 3710757 (1973-01-01), Porter
patent: 3749383 (1973-07-01), Voigt et al.
patent: 4008815 (1977-02-01), Fisk
patent: 4075972 (1978-02-01), Yamanaki et al.
Camus, "Automatic Air-Tight Closing System for Diffusion Process Quartz Tube", IBM Disclosure Bull. vol. 24, No. 11B (Apr. 1982) pp. 6075-6076.
Benzing et al., Automation in CVD Wafer Processing, in Solid State Technology (Jan., 1975), pp. 39-42.
Franson, "Automating the Epitaxial Process", in Electronics, (Nov. 14, 1974), pp. 69-71.
Landis et al., "Automatic Diffusion Furnace System Using Microprocessor Control", in Solid State Technology (Jul., 1977), pp. 34-37.

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