Semiconductor device adhesive sheet with conductor bodies...

Details Semiconductor device adhesive sheet with conductor bodies... Semiconductor device adhesive sheet with conductor bodies...

2005-06-28

2005-06-28

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Reexamination Certificate

active

06911720

ABSTRACT:
A semiconductor device, which is obtained by sticking an adhesive sheet1comprising a base material2, an adhesive agent layer3formed on the base material2and conductor bodies4buried in the adhesive agent layer3to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet1. The adhesive agent layer3and a substrate are then aligned and the semiconductor wafer and the substrates are adhered via the adhesive agent layer3to thereby avoid defects caused by fluidity of an under filling material.

REFERENCES:
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5216807 (1993-06-01), Yoshizawa et al.
patent: 5637176 (1997-06-01), Gilleo et al.
patent: 5751068 (1998-05-01), McMahon et al.
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6673441 (2004-01-01), Tanaka et al.

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