Process of fabricating a circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S830000, C174S262000, C216S019000, C427S097700

Reexamination Certificate

active

07743494

ABSTRACT:
A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.

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patent: 2006/0213685 (2006-09-01), Wang et al.

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