Process for manufacturing a printed wiring board

Details Process for manufacturing a printed wiring board Process for manufacturing a printed wiring board

2005-06-14

2005-06-14

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S832000, C029S841000, C029S846000, C029S847000, C174S261000, C174S264000, C216S017000, C216S018000, C216S020000

Reexamination Certificate

active

06904674

ABSTRACT:
A printed wiring board, particularly, an interposer20for a chip scale package, comprising an outer insulator layer22having outer electrodes31,a conductor layer21,and an inner insulator layer23having inner electrodes27,the electrodes31and/or27having been formed by electroplating using, as a negative electrode, a metal plate32that has been provided on the outer insulator layer22and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.

REFERENCES:
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5373627 (1994-12-01), Grebe
patent: 5388328 (1995-02-01), Yokono et al.
patent: 5821626 (1998-10-01), Ouchi et al.
patent: 6159853 (2000-12-01), Lai
patent: 6617681 (2003-09-01), Bohr
patent: 6662442 (2003-12-01), Matsui et al.
patent: 7-186323 (1995-07-01), None
patent: 10-135598 (1998-05-01), None

Affiliated with

Also associated with

Rating

Process for manufacturing a printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing a printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing a printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3491341