Polishing pad conditioner and chemical mechanical polishing...

Details Polishing pad conditioner and chemical mechanical polishing... Polishing pad conditioner and chemical mechanical polishing...

2006-08-29

2006-08-29

Rose, Robert A. (Department: 3723)

Abrading

Machine

Combined

C451S443000

Reexamination Certificate

active

07097545

ABSTRACT:
Chemical mechanical apparatuses including a polishing pad conditioning unit for improving a conditioning rate and wear uniformity of a polishing pad are provided. In one aspect, a chemical mechanical polishing apparatus includes a polishing pad conditioner including conditioning disks disposed in a radial direction of a planarizing surface of a circular polishing pad and contacted with the planarizing surface of the circular polishing pad during rotation of the circular polishing pad. The conditioning disks are connected to first drive units supported by an arm disposed over the circular polishing pad and extended in a radial direction of a planarizing surface of the circular polishing pad. The arm is connected to second drive units. The second drive units move the arm horizontally and reciprocally in the radial direction of the planarizing surface of the circular polishing pad. Thus, a conditioning rate and wear uniformity of the polishing pad may be improved.

REFERENCES:
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5857898 (1999-01-01), Hiyama et al.
patent: 5941762 (1999-08-01), Ravkin et al.
patent: 6893336 (2005-05-01), Jin

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