Polishing apparatus

Details Polishing apparatus Polishing apparatus

2006-06-20

2006-06-20

Nguyen, George (Department: 3723)

Abrading

Machine

Combined

C451S287000, C451S288000, C451S289000, C451S066000

Reexamination Certificate

active

07063600

ABSTRACT:
The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

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