Piezoelectric element package in which a piezoelectric element o

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

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310340, H01L 4108, H03H 915

Patent

active

058380930

ABSTRACT:
A piezoelectric element package includes a chip carrier having a shielding surface and a cavity for enclosing a piezoelectric element therein, and a cap having a central axis and a shielding material on a bottom surface of the cap, the cap shielding the piezoelectric element, enclosed in the cavity of the chip carrier, with the shielding material bonded to the shielding surface of the chip carrier. The cap is in a substantially circular shape and the shielding material of the cap and the shielding surface of the chip carrier are bonded to each other such that a bonding area between the shielding material and the shielding surface is unchanged.

REFERENCES:
patent: 3931388 (1976-01-01), Hafner et al.
patent: 4295009 (1981-10-01), Weidler
patent: 4376505 (1983-03-01), Wojcik
patent: 4376560 (1983-03-01), Olsson et al.
patent: 4512509 (1985-04-01), Ellis et al.
patent: 4857988 (1989-08-01), Fottler
patent: 5135402 (1992-08-01), Sweeney

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