Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1997-07-16
1998-12-15
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
522102, 522109, 522101, 522111, 522146, G03F 7028
Patent
active
058494600
ABSTRACT:
A photosensitive resin composition for use in manufacture of multi-layer circuit boards with connecting holes between layers is disclosed. The resin composition has excellent adhesion with a plating metal, resolution, photo-curing, thermosetting, thermal resistance, and is capable of being developed using an alkaline solution or an aqueous solution containing a non-halogen based organic solvent as the developing solution. The resin composition comprises a photosensitive epoxy resin, a thermosetting epoxy resin, a reactant of a carboxylic acid added to an acrylonitrile-butadiene rubber and an epoxy resin, a photo-polymerization initiator and a thermosetting agent. This reactant facilitates a high density pattern of connecting holes for circuit boards of the layered type.
REFERENCES:
patent: 4469777 (1984-09-01), O'Neil
patent: 4554229 (1985-11-01), Small, Jr.
patent: 4628022 (1986-12-01), Ors et al.
patent: 5100767 (1992-03-01), Yanagawa et al.
patent: 5178988 (1993-01-01), Leech et al.
PTO 96-3803, English Translation of Japanese Kokoku Patent No. Hei 1996, 40 pages.
Roger Grant et al, Grant & Hackh's Chemnical Dictionary 5th Ed, McGraw Hill Book Company, New York, NY, 1987, p.216, "Epoxy*".
Sybil P. Parker, ed, McGraw-Hill Dictionary of Chemical Terms, McGraw Hill Book Company, New York, NY, 1985, p. 155, "epoxy resin".
Encyclopedia of Polymer Science and Engineering, vol. 6, John Wiley & Sons, New York, N.Y, 1986, pp. 322-334.
Katagiri Jun'ichi
Kawai Yoshinori
Kawamoto Mineo
Nemoto Masanori
Takahashi Akio
Hamilton Cynthia
Hitachi , Ltd.
LandOfFree
Photosensitive resin composition and method for using the same i does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin composition and method for using the same i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition and method for using the same i will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1456332