Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-09-01
2009-08-11
Huff, Mark F (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S313000, C430S317000, C430S005000, C430S314000
Reexamination Certificate
active
07572572
ABSTRACT:
Methods of forming arrays of small, densely spaced holes or pillars for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with pitch-reduction techniques, to create densely-packed features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed patterns of crossing elongate features with pillars at the intersections. Spacers are simultaneously applied to sidewalls of both sets of crossing lines to produce a pitch-doubled grid pattern. The pillars facilitate rows of spacers bridging columns of spacers.
REFERENCES:
patent: 4234362 (1980-11-01), Riseman
patent: 4419809 (1983-12-01), Riseman et al.
patent: 4432132 (1984-02-01), Kinsbron et al.
patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4508579 (1985-04-01), Goth et al.
patent: 4648937 (1987-03-01), Ogura et al.
patent: 4716131 (1987-12-01), Okazawa et al.
patent: 4776922 (1988-10-01), Bhattacharyya et al.
patent: 4838991 (1989-06-01), Cote et al.
patent: 5013680 (1991-05-01), Lowrey et al.
patent: 5047117 (1991-09-01), Roberts
patent: 5053105 (1991-10-01), Fox, III
patent: 5117027 (1992-05-01), Bernhardt et al.
patent: 5328810 (1994-07-01), Lowrey et al.
patent: 5330879 (1994-07-01), Dennison
patent: 5470661 (1995-11-01), Bailey et al.
patent: 5514885 (1996-05-01), Myrick
patent: 5670794 (1997-09-01), Manning
patent: 5753546 (1998-05-01), Koh et al.
patent: 5789320 (1998-08-01), Andricacos et al.
patent: 5795830 (1998-08-01), Cronin et al.
patent: 5830332 (1998-11-01), Babich et al.
patent: 5899746 (1999-05-01), Mukai
patent: 5998256 (1999-12-01), Juengling
patent: 6004862 (1999-12-01), Kim et al.
patent: 6010946 (2000-01-01), Hisamune et al.
patent: 6042998 (2000-03-01), Brueck et al.
patent: 6057573 (2000-05-01), Kirsch et al.
patent: 6063688 (2000-05-01), Doyle et al.
patent: 6071789 (2000-06-01), Yang et al.
patent: 6110837 (2000-08-01), Linliu et al.
patent: 6143476 (2000-11-01), Ye et al.
patent: 6211044 (2001-04-01), Xiang et al.
patent: 6288454 (2001-09-01), Allman et al.
patent: 6291334 (2001-09-01), Somekh
patent: 6297554 (2001-10-01), Lin
patent: 6335257 (2002-01-01), Tseng
patent: 6348380 (2002-02-01), Weimer et al.
patent: 6362057 (2002-03-01), Taylor, Jr. et al.
patent: 6383907 (2002-05-01), Hasegawa et al.
patent: 6395613 (2002-05-01), Juengling
patent: 6423474 (2002-07-01), Holscher
patent: 6455372 (2002-09-01), Weimer
patent: 6514884 (2003-02-01), Maeda
patent: 6522584 (2003-02-01), Chen et al.
patent: 6534243 (2003-03-01), Templeton
patent: 6548396 (2003-04-01), Naik et al.
patent: 6559017 (2003-05-01), Brown et al.
patent: 6566280 (2003-05-01), Meagley et al.
patent: 6573030 (2003-06-01), Fairbairn et al.
patent: 6602779 (2003-08-01), Li et al.
patent: 6632741 (2003-10-01), Clevenger et al.
patent: 6667237 (2003-12-01), Metzler
patent: 6673684 (2004-01-01), Huang et al.
patent: 6686245 (2004-02-01), Mathew et al.
patent: 6689695 (2004-02-01), Lui et al.
patent: 6706571 (2004-03-01), Yu et al.
patent: 6709807 (2004-03-01), Hallock et al.
patent: 6734107 (2004-05-01), Lai et al.
patent: 6744094 (2004-06-01), Forbes
patent: 6773998 (2004-08-01), Fisher et al.
patent: 6794699 (2004-09-01), Bissey et al.
patent: 6800930 (2004-10-01), Jackson et al.
patent: 6835662 (2004-12-01), Erhardt et al.
patent: 6867116 (2005-03-01), Chung
patent: 6875703 (2005-04-01), Furukawa et al.
patent: 6893972 (2005-05-01), Rottstegge et al.
patent: 6924191 (2005-08-01), Liu et al.
patent: 6962867 (2005-11-01), Jackson et al.
patent: 7015124 (2006-03-01), Fisher et al.
patent: 7074668 (2006-07-01), Park et al.
patent: 7183597 (2007-02-01), Doyle
patent: 7208379 (2007-04-01), Venugopal et al.
patent: 7288445 (2007-10-01), Bryant et al.
patent: 7291560 (2007-11-01), Parascandola et al.
patent: 2002/0042198 (2002-04-01), Bjarnason et al.
patent: 2002/0045308 (2002-04-01), Juengling
patent: 2002/0063110 (2002-05-01), Cantell et al.
patent: 2002/0068243 (2002-06-01), Hwang et al.
patent: 2002/0127810 (2002-09-01), Nakamura et al.
patent: 2003/0006410 (2003-01-01), Doyle
patent: 2003/0044722 (2003-03-01), Hsu et al.
patent: 2003/0109102 (2003-06-01), Kujirai et al.
patent: 2003/0119307 (2003-06-01), Bekiaris et al.
patent: 2003/0127426 (2003-07-01), Chang et al.
patent: 2003/0157436 (2003-08-01), Manger et al.
patent: 2003/0207207 (2003-11-01), Li
patent: 2003/0207584 (2003-11-01), Sivakumar et al.
patent: 2003/0216050 (2003-11-01), Golz et al.
patent: 2003/0230234 (2003-12-01), Nam et al.
patent: 2004/0000534 (2004-01-01), Lipinski
patent: 2004/0017989 (2004-01-01), So
patent: 2004/0018738 (2004-01-01), Liu
patent: 2004/0023475 (2004-02-01), Bonser et al.
patent: 2004/0023502 (2004-02-01), Tzou et al.
patent: 2004/0041189 (2004-03-01), Voshell et al.
patent: 2004/0043623 (2004-03-01), Liu et al.
patent: 2004/0053475 (2004-03-01), Sharma
patent: 2004/0079988 (2004-04-01), Harari
patent: 2004/0106257 (2004-06-01), Okamura et al.
patent: 2004/0235255 (2004-11-01), Tanaka et al.
patent: 2005/0074949 (2005-04-01), Jung et al.
patent: 2005/0112886 (2005-05-01), Asakawa et al.
patent: 2005/0142497 (2005-06-01), Ryou
patent: 2005/0153562 (2005-07-01), Furukawa et al.
patent: 2005/0164454 (2005-07-01), Leslie
patent: 2005/0167394 (2005-08-01), Liu et al.
patent: 2005/0186705 (2005-08-01), Jackson et al.
patent: 2005/0272259 (2005-12-01), Hong
patent: 2006/0003182 (2006-01-01), Lane et al.
patent: 2006/0024945 (2006-02-01), Kim et al.
patent: 2006/0046161 (2006-03-01), Yin et al.
patent: 2006/0046200 (2006-03-01), Abatchev et al.
patent: 2006/0046201 (2006-03-01), Sandhu et al.
patent: 2006/0046422 (2006-03-01), Tran et al.
patent: 2006/0046484 (2006-03-01), Abatchev et al.
patent: 2006/0083996 (2006-04-01), Kim
patent: 2006/0172540 (2006-08-01), Marks et al.
patent: 2006/0189150 (2006-08-01), Jung
patent: 2006/0211260 (2006-09-01), Tran et al.
patent: 2006/0216923 (2006-09-01), Tran et al.
patent: 2006/0231900 (2006-10-01), Lee et al.
patent: 2006/0250593 (2006-11-01), Nishii
patent: 2006/0263699 (2006-11-01), Abatchev et al.
patent: 2006/0267075 (2006-11-01), Sandhu et al.
patent: 2006/0273456 (2006-12-01), Sant et al.
patent: 2006/0281266 (2006-12-01), Wells
patent: 2007/0026672 (2007-02-01), Tang et al.
patent: 2007/0045712 (2007-03-01), Haller et al.
patent: 2007/0048674 (2007-03-01), Wells
patent: 2007/0049011 (2007-03-01), Tran
patent: 2007/0049030 (2007-03-01), Sandhu et al.
patent: 2007/0049032 (2007-03-01), Abatchev et al.
patent: 2007/0049035 (2007-03-01), Tran
patent: 2007/0049040 (2007-03-01), Bai et al.
patent: 2007/0050748 (2007-03-01), Juengling
patent: 2007/0200178 (2007-08-01), Yun et al.
patent: 2007/0210449 (2007-09-01), Caspary et al.
patent: 2007/0215960 (2007-09-01), Zhu et al.
patent: 2007/0275309 (2007-11-01), Liu
patent: 0227303 (1987-07-01), None
patent: 0491408 (1992-06-01), None
patent: 1357433 (2003-10-01), None
patent: 05343370 (1993-12-01), None
patent: H8-55908 (1996-02-01), None
patent: H8-55920 (1996-02-01), None
patent: 1999-027887 (1999-04-01), None
patent: WO 94/15261 (1994-07-01), None
patent: WO 02/099864 (2002-12-01), None
patent: WO 2004/001799 (2003-12-01), None
patent: WO 2004/003977 (2004-01-01), None
patent: WO 2005/034215 (2005-04-01), None
patent: WO 2006/026699 (2006-03-01), None
“U.S. Appl. No. 11/543,515, filed Oct. 24, 2006, Micron Ref. No. 2005-1173.00/US”.
“Ex parte Cantell, unpublished decision of the Board of Patent Appeals and Interferences, Mar. 4, 2005”.
“Sublithographic nanofabrication technology for nanocatalysts and DNA chips,”J. Vac. Sci. Technol., Nov./Dec. 2003; pp. 2951-2955, Nov./Dec. 2003, Choi et al.
Bergeron, et al., “Resolution Enhancement Techniques for the 90nm Technology Node and Beyond,” Future Fab International, Issue 15, Jul. 11, 2003, 4 pages.
Bhave et al., “Developer-soluble Gap fill materials for patterning metal trenches in Via-first Dual Damascene process,” preprint of Proceedings of SPIE: Advances in Resist Technology and Processing XXI, vol. 5376, John L. Sturtevant, edi
Huff Mark F
Knobbe Martens Olson & Bear LLP
Micro)n Technology, Inc.
Sullivan Caleen O
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