Method of spiral resist deposition

Details Method of spiral resist deposition Method of spiral resist deposition

1994-12-14

1996-07-02

Thomas, Tom

Fishing, trapping, and vermin destroying

437240, 118 52, H01L 21312

Patent

active

055321925

ABSTRACT:
A method of depositing a material upon a substrate is disclosed. A material, such as photoresist, is deposited upon a substrate such as a semiconductor wafer by spinning the substrate and commencing deposition at the edge of the wafer and moving inward in a spiral pattern. The method produces a more uniform coating than hitherto available.

REFERENCES:
patent: 3198657 (1965-08-01), Kimball et al.
patent: 4267212 (1981-05-01), Sakawaki
patent: 4451507 (1984-05-01), Beltz et al.
patent: 5094884 (1992-03-01), Hillman
Method For Coating Photoresist Patent Abstracts of Japan vol. 7, No. 70 (P-185) (1215) 23 Mar. 1983.
E-388 (2122) Patent Abstracts of Japan vol. 10, No. 65. 14 Mar. 1986.
Patent No. Patent Abstracts of Japan, issued in Japan on 27 Jul. 1988 to Hiroki Nezu.

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