Fishing – trapping – and vermin destroying
Patent
1992-03-06
1994-04-05
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437235, 437238, 437240, 437236, H01L 2100, H01L 2102, H01L 21465
Patent
active
053004639
ABSTRACT:
A method of utilizing and etching SiO.sub.2 in the processing of semiconductor wafers comprises: a) providing a layer of undoped SiO.sub.2 atop a wafer; b) providing a layer of doped SiO.sub.2 atop the layer of undoped SiO.sub.2 ; and c) wet etching the layer of doped SiO.sub.2 selectively relative to the undoped layer of SiO.sub.2 utilizing an acid solution, the acid solution comprising a mixture of at least two different mineral acids provided in a selected ratio relative to one another, one of the mineral acids being HF. The preferred volumetric ratio of other mineral acids in the acid solution to HF in the acid solution is from 20:1 to 110:1, with a ratio of from 45:1 to 65:1 being most preferred. Example acids to be combined with the HF include H.sub.2 SO.sub.4, HCl, HNO.sub.3, H.sub.3 PO.sub.4, HBr, HI, HClO.sub.4, and HIO.sub.4, or mixtures thereof.
REFERENCES:
patent: 3751314 (1973-08-01), Rankel
patent: 4052253 (1977-10-01), Kingzett
patent: 4211601 (1980-07-01), Mogab
Wolf, Silicon Processing for the VLSI Era, vol. 1, Lattice Press, 1986, pp. 532-534.
Cathey David A.
Rolfson J. Brett
Everhart B.
Hearn Brian E.
Micro)n Technology, Inc.
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