Method of producing of circuit board; for semiconductor device

Details Method of producing of circuit board; for semiconductor device Method of producing of circuit board; for semiconductor device

2006-10-03

2006-10-03

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C427S097100, C205S123000

Reexamination Certificate

active

07114251

ABSTRACT:
A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.

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