Method for polishing a wafer by supplying surfactant to the rear

Details Method for polishing a wafer by supplying surfactant to the rear Method for polishing a wafer by supplying surfactant to the rear

1996-01-23

1997-04-01

Breneman, R. Bruce

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

216 88, 451287, 451289, H01L 21306

Patent

active

056162120

ABSTRACT:
In a wafer polishing method and a device therefor, a surfactant solution is applied to the rear of a wafer by spraying or immersion before the wafer is attached to a holder. Even when the rear of the wafer is hydrophobic, it does not repel the solution and can be entirely covered therewith. Hence, it is possible to enhance the even polishing of the wafer while insuring the holding of the wafer. In addition, particles left on the wafer after polishing are easily removed in a cleaning step to follow.

REFERENCES:
patent: 4156619 (1979-05-01), Greisshammer
patent: 4184908 (1980-01-01), Lackner et al.
patent: 4256535 (1981-03-01), Banks
patent: 4373991 (1983-02-01), Banks
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5545076 (1996-08-01), Yun et al.
patent: 5573448 (1996-11-01), Nakazima et al.

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