Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1995-09-29
1998-08-04
Niebling, John
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438402, 438476, H01L 2100, H01L 21326, H01L 2184
Patent
active
057892849
ABSTRACT:
An object of the present invention is to provide a technology of reducing a nickel element in the silicon film which is crystallized by using nickel. An extremely small amount of nickel is introduced into an amorphous silicon film which is formed on the glass substrate. Then this amorphous silicon film is crystallized by heating. At this time, the nickel element remains in the crystallized silicon film. Then an amorphous silicon film is formed on the surface of the silicon film crystallized with the action of nickel. Then the amorphous silicon film is further heat treated. By carrying out this heat treatment, the nickel element is dispersed from the crystallized silicon film into the amorphous silicon film with the result that the nickel density in the crystallized silicon film is lowered.
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Miyanaga Akiharu
Ohtani Hisashi
Teramoto Satoshi
Yamazaki Shunpei
Costellia Jeffrey L.
Ferguson Jr. Gerald J.
Lebentritt Michael S.
Niebling John
Semiconductor Energy Laboratory Co,. Ltd.
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