Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-11-26
1999-08-03
Picardat, Kevin M.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438612, 438615, H01L 2144
Patent
active
059337524
ABSTRACT:
Disclosed herein is a solder bump forming method and a sputter deposition apparatus used in this method which improves a bonding strength between a metal film having a solder bump forming region and an undercoating for the metal film. This method includes the steps of forming an opening through the undercoating, forming the metal film on the undercoating by a lift-off process so that the metal film is connected through the opening to an electrode pad formed on a substrate of a semiconductor device chip and has the solder bump forming region different from a region on the electrode pad, and forming a solder bump on the solder bump forming region of the metal film. This method further includes the steps of heating the undercoating after forming the resist pattern having an opening for exposing the electrode pad, the undercoating corresponding to the solder bump forming region, and a region connecting the electrode pad and the solder bump forming region, performing plasma processing to reduce the diameter of the opening of the resist pattern at its opening edge, and depositing the metal film on the undercoating. The sputter deposition apparatus includes a plasma processing device for performing plasma processing to the substrate to reduce the diameter of the opening of the resist pattern at its opening edge, and a sputter deposition device for depositing the metal film on the undercoating. The plasma processing device includes at least a lamp heater for heating the substrate.
REFERENCES:
patent: 4861425 (1989-08-01), Greer et al.
patent: 5593903 (1997-01-01), Beckenbaugh et al.
patent: 5698465 (1997-12-01), Lynch et al.
Collins Deven
Picardat Kevin M.
Sony Corporation
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