Method and apparatus for forming bump structure used for flip-ch

Details Method and apparatus for forming bump structure used for flip-ch Method and apparatus for forming bump structure used for flip-ch

1995-06-06

1997-05-27

Picardat, Kevin

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438617, H01L 2160

Patent

active

056332041

ABSTRACT:
A bump structure has a bump constituted by a metal projection which is formed on an electrode of a substrate, and a solder which covers the metal projection but does not touch the electrode. The metal projection is substantially spherical and has a projected portion at a center portion on an upper surface thereof. The metal projection is made of a metal having properties of solder diffusion prevention and adhesion to solder. The bump structure may have two bumps, the first bump being substantially the same as the bump described above and the second being such that its diameter is smaller than an outer diameter of the first bump and it covers the projected portion on the first bump. This bump structure can be formed using a simple process, and can be applied to flip-chip mounting in semiconductor devices with high reliability and yield.

REFERENCES:
patent: 4000842 (1977-01-01), Burns
patent: 4263606 (1981-04-01), Yorikawe
patent: 4742023 (1988-05-01), Hasegawa
patent: 4818728 (1989-04-01), Rai et al.
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 5289631 (1994-03-01), Koopman et al.
Y. Tomura et al., "Chip-On-Board Mounting Technology Using Stud-Bump-Bonding Technique", National Technical Report, vol. 39, No. 2, Apr. 1993, pp. 90-97.
"Flip Chip Mounting Using Stud Bumps and Adhesives for Encapsulation", Fujitsu, vol. 43, No. 7, Nov. 1992, pp. 773-778 with English-language Abstract.

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