Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-17
2008-05-13
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S730000, C257S738000
Reexamination Certificate
active
07371673
ABSTRACT:
A technique for attaching solder balls of a BGA to a PCB. In one example embodiment, this is accomplished by applying solder paste onto at least one of a plurality of contact pads on a PCB. At least one of a plurality of solder balls of an IC device are then onto the at least one of the plurality of contact pads on the PCB. The temperature is then increased to reflow the solder paste. The IC device is then pulled away from the PCB as a function of a geometric shape of the IC device and held in a new position upon reflowing the solder paste to transform the at least one of the plurality of solder balls and the reflowed solder paste into a high shear strength solder joint structure. The reflow temperature is then lowered to room temperature to attach the high shear strength solder joint structure to the at least one of the plurality of lands on the PCB.
REFERENCES:
patent: 6153505 (2000-11-01), Bolde et al.
patent: 6521530 (2003-02-01), Peters et al.
patent: 6689678 (2004-02-01), James et al.
patent: 6774497 (2004-08-01), Qi et al.
patent: 2002/0076919 (2002-06-01), Peters et al.
patent: 2003/0096453 (2003-05-01), Wang et al.
patent: 2005/0090040 (2005-04-01), Geng et al.
patent: 2006/0263929 (2006-11-01), Matsunami
Brady III Wade J.
Lebentritt Michael
Stevenson Andre′
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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