Integrated liquid cooled heat sink for electronic components

Details Integrated liquid cooled heat sink for electronic components Integrated liquid cooled heat sink for electronic components

2005-06-15

2009-10-20

Flanigan, Allen J (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S080400, C165S104330, C361S699000, C361S700000

Reexamination Certificate

active

07604040

ABSTRACT:
A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling housing from the lower portion. A heat rejecter is disposed on and above the upper wall of the cooling housing with a first header extending from and in fluid communication with the liquid coolant outlet. A second header extends upwardly from a rejecter outlet. A plurality of first tubes extend between and in fluid communication with the first header and the second header with a plurality of first air fins disposed between the upper wall and the first tubes. A single unit defines both the cooling housing and the air cooled heat rejecter to thereby allow the manufacture of the unit in a single process with the attendant reduction in shipping, handling and installation.

REFERENCES:
patent: 2083611 (1937-06-01), Marshall
patent: 5304846 (1994-04-01), Azar
patent: 5529115 (1996-06-01), Paterson
patent: 6005772 (1999-12-01), Terao et al.
patent: 6422307 (2002-07-01), Bhatti
patent: 6702002 (2004-03-01), Wang
patent: 6808015 (2004-10-01), Osakabe
patent: 7100677 (2006-09-01), Lee et al.

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