Epoxy resin-impregnated prepreg

Details Epoxy resin-impregnated prepreg Epoxy resin-impregnated prepreg

1993-01-05

1995-07-25

Clark, W. Robinson

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525523, C08L 6302, C08L 6304, C08L 7706, C08L 7710

Patent

active

054363012

ABSTRACT:
An epoxy resin-impregnated prepreg useful for the production of a copper foil-laminated board of a chip-on-board having a high heat resistance, high dimension stability and high silver migration-preventing property, comprises an aromatic polyamide fiber base material having 3.0% by weight or less of an equilibrium moisture content, 80 ppm or less of an extracted chlorine content and 50 ppm or less of an extracted sodium content, and an epoxy resin composition comprising an epoxy resin and a curing agent, containing 5 ppm or less of sodium and 600 ppm or less of chlorine and impregnated in the base material, said aromatic polyamide fibers having been produced by a wet spin-drawing process having a draw-washing procedure in which undrawn aromatic polyamide filaments are drawn at a draw ratio of 1.05 to 1.5, while forwarding the filaments through a hot water bath having a path length of 1 to 50 m and while flowing hot water at 30.degree. C. to 100.degree. C. through the bath in a counter direction against the forwarding direction of the filaments to effectively squeeze out impurities from the filaments.

REFERENCES:
patent: 4532275 (1985-07-01), Aito et al.

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