Electrical interconnect for multilayer transducer elements of a

Details Electrical interconnect for multilayer transducer elements of a Electrical interconnect for multilayer transducer elements of a

1993-08-04

1995-01-10

Eldred, J. Woodrow

Communications, electrical: acoustic wave systems and devices

Signal transducers

367155, 310334, 310336, 310365, 12866203, H04R 1700

Patent

active

053813855

ABSTRACT:
A multilayer two-dimensional array of ultrasonic transducer elements includes four via segments at the four corners of each transducer element. A first pair of diagonally opposed via segments provide signals to signal electrode layers of each transducer element. A second pair of diagonally opposed via segments interconnect ground electrode layers. Thus, a redundant interconnection scheme is achieved. If the transducer elements include piezoelectric layers having a square cross section parallel to a transducer radiating surface, four-fold symmetry is maintained, despite the formation of the four via segments. Also disclosed is a method of forming a two-dimensional array.

REFERENCES:
patent: 4633122 (1986-12-01), Radice
patent: 4638468 (1987-01-01), Francis
patent: 4734044 (1988-03-01), Radice
patent: 4825115 (1989-04-01), Kawabe et al.
patent: 4881212 (1989-11-01), Takeuchi
patent: 5163436 (1992-11-01), Saitoh et al.
Goldberg et al., "Multi-Layer PZT Transducer Arrays for Improved Sensitivity," IEEE Ultrasonics Symposium, 1051-0117/92/0000-0551, pp. 551-554, 1992.
Smith et al., "Two-Dimensional Array Transducers using Hybrid Connection Technology," IEEE Ultrasonics Symposium, 1051-0117/92/0000-0555, pp. 555-558, 1992.

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