Flip-chip technique for chip assembly
Flip-chip type semiconductor device and method of...
Flip-flop semiconductor device packaging using an interposer
Fluxless assembly of chip size semiconductor packages
Fluxless flip chip interconnection
Folded interposer
Forced heat transfer apparatus for heating stacked dice
Forming a 3-D semiconductor die structure with an...
Global planarization of wafer scale package with precision...
HDI module with integral conductive electromagnetic shield
Heat spreader anchoring & grounding method &...
Heat spreader anchoring and grounding method and thermally...
Heat-radiating tape carrier package and method for...
High density electronic interconnection
High density flip chip BGA
High density flip chip BGA
High density modularity for IC's
High density semiconductor package and method of fabrication
High density stackable and flexible substrate-based devices...
High density three-dimensional IC interconnection