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Selected: L

LOC (lead on chip) package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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LOC semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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LOC semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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LOC SIMM

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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LOC SIMM

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Local charge and work function engineering on MOSFET

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Local control of electrical and mechanical properties of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Local electrochemical deplating of alignment mark regions of...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Local ESD protection for low-capicitance applications

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Device protection
Reexamination Certificate

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Local ground and VCC connection in an SRAM cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Local ground plane for high frequency circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Local interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Local interconnect comprising titanium nitride barrier layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Local interconnect for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Local interconnect for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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