LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Die package and probe card structures and fabrication methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Die package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die package with asymmetric leadframe connection

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Die pad for semiconductor packages and methods of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die pad structure for solder bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die paddle clamping for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Die paddle for receiving an integrated circuit die in a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Die pillar structures and a method of their formation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Die positioning in integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Die power distribution system

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Die rearrangement package structure using layout process to...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Die seal for semiconductor device moisture protection

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Die seal structure for a semiconductor integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Die seal structure for reducing stress induced during die...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Die size-increasing integrated circuit leads and thermally...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Die stacking apparatus and method