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Die attach material for TBGA or flexible circuitry

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Die attach method and leadframe structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Die attach pad adapted to reduce delamination stress and...

Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead – On integrated circuit
Utility Patent

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Die attach pad for use in semiconductor manufacturing and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die attach paddle for mounting integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die attach region for use in a micro-array integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die attachment and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate

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Die attachment with reduced adhesive bleed-out

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Die carrier with fluid chamber

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Die clip assembly for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Die connected with integrated circuit component for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Die corner alignment structure

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Die for forming an optical element, and production method as...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Die interconnections using intermediate connection elements secu

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Die offset die to die bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Die package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Die package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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