LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Added P-well implantation for uniform current distribution in ES

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Addition of metal layers with signal reallocation to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Additional capacitance for MIM capacitors with no additional...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Additional gate control for a double-gate MOSFET

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Additional metal routing in semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Additional n-type LDD/pocket implant for improving...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Addressable fuse array for circuits and mechanical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Adhering layers to metals with dielectric adhesive layers

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

Adhesion and/or encapsulation of silicon carbide-based...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Adhesion between dielectric layers in an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Adhesion between dielectric materials

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Adhesion by plasma conditioning of semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Adhesion by plasma conditioning of semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Adhesion layer for a polymer memory device and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Adhesion of copper and etch stop layer for copper alloy

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Adhesion of silicon carbide films