Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...
428 15, 428218, 428326, 428528, 428529, 428535, 156 622, B32B 516
Substitute lumber pieces having strengths and densities substantially equivalent to lumber are cut from single layer panels of over about 1 and normally less than 4 inches thickness made from wood wafers. The wafers are oriented with their lengths having a mean deviation to the longitudinal length of the panel measured in the major plane of the panel in the range of 0 to 10 degrees and a mean deviation measured in a minimum longitudinal plane perpendicular to the major plane from 0 to about 5 degrees and have an average effective length of at least 8 inches (200 mm), and preferably an average thickness less than 0.15 inches (4 mm) and a width of at least 0.25 inches (6 mm). Lumber is made by cutting the panel longitudinally. Preferably the panels are formed to have a substantially uniform density profile throughout their thicknesses.
patent: 3164511 (1965-01-01), Elmendorf
patent: 3956555 (1976-05-01), McKean
patent: 4061819 (1977-12-01), Barnes
patent: 4122236 (1978-10-01), Holman
patent: 4241133 (1980-12-01), Lund et al.
patent: 4384019 (1983-05-01), Haataja
patent: 4404252 (1983-09-01), Hetzler et al.
patent: 4492726 (1985-01-01), Rosenberg
patent: 4610913 (1986-09-01), Barnes
Stofko, J., "The Effect of Molding Pressure on the Physical and Mechanical Properties of a Material Manufactured from Long Oriented Wood Elements", Drevarsky Vyskum 2, no. 1; 81-102 (1957) (translation).
Stofko, J., "The Relation Between the Dimensions and Geometry of Wood Particles and the Mechanical Properties of Wood Particle Boards", Drevarsky Vyskum 5, No. 2: 241-261 (1960) (translation).
Stofko, J., "Particle Board with Oriented Particles", Drevarsky Vyskum, 2, 127-148, (1962) (translation).
Stofko, J., "Particle Board with Oriented Particles", Druna Industrija 21(6), 104-107, (1970) (translation).
Gibson Sharon A.
MacMillan Bloedel Limited
Rowley C. A.
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