Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
528 87, 528481, 528502, 264102, 428543, C08G 5902, C08J 500
A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.
patent: 4596837 (1986-06-01), Yamamoto et al.
Chemical Abstracts 105, 135129f (1986).
Mitsubishi Denki & Kabushiki Kaisha
Tablet for resin-molding semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.If you have personal experience with Tablet for resin-molding semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tablet for resin-molding semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-585753