Method for a bin ratio forecast at new tape out stage

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Details

C700S099000, C700S110000, C700S121000

Reexamination Certificate

active

08082055

ABSTRACT:
A method for providing a bin ratio forecast at an early stage of integrated circuit device manufacturing processes is disclosed. The method comprises collecting historical data from one or more processed wafer lots; collect measurement data from one or more skew wafer lots; generating an estimated baseline distribution from the collected historical data and collected measurement data; generating an estimated performance distribution based on one or more specified parameters and the generated estimated baseline distribution; determining a bin ratio forecast by applying a bin definition and a yield degradation factor estimation to the generated estimated performance distribution; determining one or more production targets based on the bin ratio forecast; and processing one or more wafers based on the one or more determined production targets.

REFERENCES:
patent: 6610550 (2003-08-01), Pasadyn et al.
patent: 6901564 (2005-05-01), Stine et al.
patent: 7580924 (2009-08-01), Ling et al.
patent: 2006/0241802 (2006-10-01), Chen et al.
patent: 2010/0268367 (2010-10-01), Wu et al.

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