Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k
505701, 505702, 505703, 505704, 428426, 428432, 428433, 428688, 428698, 428901, 428930, B32B 900
The present invention provides a method for joining of high-temperature oxide superconductors per se or a high-temperature oxide superconductor and other conductive material through a very simple process. According to this method, the joining is carried out by using an alloy comprising 0.1%-90% by weight of at least one divalent metallic element and the balance as a brazing material and heating and melting the brazing material. The resulting joined body has a joint low in resistance. The divalent metallic element of the alloy is preferably an element of Group IIA or IIB of the Periodic Table or a transition metal.
patent: 4870051 (1989-09-01), Maxfield et al.
patent: 4879270 (1989-11-01), Maxfield et al.
Zis-Mitteilungen, vol. 29, No. 4, Apr. 1987, W. John, "Herstellungsverfahren und Verfahreh von Lotpasten fur die Electronik", pp. 401-404 and English translation.
Applied Physics Letters, vol. 52, No. 4, Jan. 1988, J. E. Ekin, et al. "Method for Making Low-Resistivity Contacts to High Tc Superconductors", pp. 331-333.
Cryogenics, vol. 27, Aug. 1987, P. Bruzzone, "Electrical Properties of Low Melting Point alloys at 4.2 K", pp. 433-436.
Hitachi , Ltd.
Ryan Patrick J.
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