Flatpack for hermetic encapsulation of piezoelectric components

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

310340, 357 73, H05K 506

Patent

active

047421827

ABSTRACT:
A flatpack package for hermetic encapsulation of piezoelectronic components, which flatpack is suitable for use in efficient and automated surface mounting (SMT). The flatpack package consists of a base plate, a cover plate and a mounting unit of two support frames between which are placed lamellar connecting leads leading into the package. The leads serve both for mechanical holding of the quartz resonator disk and as the electrical connection thereof. All the package parts are produced from glass, are connected to one another by using solder glass as a sealing material. The parts are dilathermally matched with one another.

REFERENCES:
patent: 4110655 (1978-08-01), Hata et al.
patent: 4293986 (1981-10-01), Kobayashi et al.
patent: 4362961 (1982-12-01), Gerber

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