Apparatus and method for making suture packages

Plastic article or earthenware shaping or treating: apparatus – With apparatus assembly or dismantling means or with idle part – Means permitting removal or substitution of elements during...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C249S102000

Reexamination Certificate

active

07837455

ABSTRACT:
Apparatus and method for making a plurality of different types of suture packages employ a mold with first and second opposing mold parts partially defining a mold cavity, at least one of the opposing mold parts has an opening therein communicating with the mold cavity. An insert is removeably inserted into the opening, to complete the mold cavity in a form suitable for molding a first type of suture package. An alternative insert is interchangeable with the first insert for completing the mold cavity in a form suitable for molding a second type of suture package. To make different suture packages, the mold is initially configured and used with one of the inserts to thereby make one type of suture package. The first insert is then replaced with the second, changing the mold cavity to form another type of suture package.

REFERENCES:
patent: 3861640 (1975-01-01), Agneta
patent: 4861254 (1989-08-01), Takeuchi et al.
patent: 4967902 (1990-11-01), Sobel et al.
patent: 5052551 (1991-10-01), Cerwin et al.
patent: 5056658 (1991-10-01), Sobel et al.
patent: 5131533 (1992-07-01), Alpen
patent: 5165217 (1992-11-01), Sobel et al.
patent: 5179818 (1993-01-01), Kalinski et al.
patent: 5180053 (1993-01-01), Cascio et al.
patent: 5213210 (1993-05-01), Cascio et al.
patent: 5230424 (1993-07-01), Alpern et al.
patent: 5236083 (1993-08-01), Sobel et al.
patent: 5255889 (1993-10-01), Collette et al.
patent: 5284240 (1994-02-01), Alpern et al.
patent: 5628395 (1997-05-01), Daniele et al.
patent: 5655652 (1997-08-01), Sobel et al.
patent: 5660024 (1997-08-01), Ivanov et al.
patent: 5664404 (1997-09-01), Ivanov et al.
patent: 5675961 (1997-10-01), Cerwin et al.
patent: 5788062 (1998-08-01), Cerwin et al.
patent: 6047815 (2000-04-01), Cerwin et al.
patent: 6098796 (2000-08-01), Januzeli et al.
patent: 6116886 (2000-09-01), Tasaka
patent: 6135272 (2000-10-01), Sobel et al.
patent: 6743202 (2004-06-01), Hirschman et al.
patent: 6782940 (2004-08-01), Billiet et al.
patent: 6853559 (2005-02-01), Panella et al.
patent: 6885563 (2005-04-01), Panella et al.
patent: 6888235 (2005-05-01), Lopata et al.
patent: 6936917 (2005-08-01), Lopata et al.
patent: 2001/0034506 (2001-10-01), Hirschman et al.
patent: 2003/0193791 (2003-10-01), Panella et al.
patent: 2003/0194832 (2003-10-01), Lopata et al.
patent: 2003/0197198 (2003-10-01), Panella et al.
patent: 2003/0202330 (2003-10-01), Lopata et al.
patent: 2004/0135504 (2004-07-01), Tamaki et al.
patent: 2006/0038477 (2006-02-01), Tamaki et al.
patent: 1433370 (1985-06-01), None
patent: 1087808 (2003-12-01), None
patent: 1369458 (2003-12-01), None
patent: 1433831 (2004-06-01), None
patent: WO9965548 (1999-12-01), None
patent: WO03028095 (2003-04-01), None
patent: WO03028420 (2003-04-01), None
patent: WO03034799 (2003-04-01), None
patent: WO03037054 (2003-05-01), None
patent: WO03072341 (2003-09-01), None
International Preliminary Report on Patentability issued on Feb. 3, 2009 in International Patent Application No. PCT/US2007/016838.
International Search Report and Written Opinion for International Patent Application No. PCT/US2007/016838.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for making suture packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for making suture packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for making suture packages will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4250733

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.