Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.
patent: 2003/0088959 (2003-05-01), Tsujimoto
patent: 2008/0044258 (2008-02-01), Akechi
patent: 2009/0107633 (2009-04-01), Yamaguchi et al.
patent: 02-0028347 (1990-01-01), None
patent: 07-0014807 (1995-01-01), None
patent: 10-0233372 (1998-09-01), None
Cheng Law Group PLLC
Nitto Denko Corporation
Adhesive tape joining apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.If you have personal experience with Adhesive tape joining apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive tape joining apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2738989